Capability
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* Min. trace width / space (Inner / External) (0.075/0.075mm)
* Min. drill size for through hole (Mechanical drill) (0.25mm)
* Min. micro via size (Laser drilling) (0.1mm)
* Min. buried via size (0.25mm)
* HDI Capability
* Aspect Ratio (Mechanical drill) 9：1
* Single ended & differential impedance control
* Max. working PNL size 21"x 24"
* Min. board overall thickness for 4-L (0.35mm) , 6-L (0.55mm), 8-L (0.80mm), 10-L+ (1.00
mm)
* Max. board overall thickness for 4, 6, 8, 10L+ (3.20mm)
* Min. thin core thickness (0.0625mm)
* Registration tolerance： Layer to layer (0.10mm); Solder mask (0.075mm)
* Min. hole location tolerance (0.05mm)
* Min. solder thickness on SMT Pads in different pitch: ≦25mil (120μ”), ≧50mil (100μ”),
＞50mil (80μ”).
* Materials: FR4 TG135, TG150, TG170, TG180 Non Dicy, Halogen Free, RCC 1/4oz, 1/3oz to
5oz copper foil
* Surface finish： HASL, OSP, Carbon Ink, Immersion Silver, Immersion Gold, Immersion Tin,
Selective Gold
2009 - 2010 Up grades
Up grades for 2009 - 2010 include the following:
* Increased production of 6L and 8L HDI products to 20%+
* Increase factory production to 120k square meters per month
* Decrease defectives rate to under 2% and customer return rate to 0%
* Achieve ISO 14001 and ISO 16949 certification in 2010 Q2 and Q4
respectively.
Up grades for 2009 - 2010 include the following:
* Increased production of 6L and 8L HDI products to 20%+
* Increase factory production to 120k square meters per month
* Decrease defectives rate to under 2% and customer return rate to 0%
* Achieve ISO 14001 and ISO 16949 certification in 2010 Q2 and Q4
respectively.
6361 Menlo Drive.
San Jose, California, USA 95120
PH: 408-858-5838
support@samsel-international.us
Copy right 2009, Samsel International Inc. All rights reserved.
