Why HDI
Pad over drill size : 10 mils
Buried via hole size : 4 mils
Blind via hole size : 4 mils
Target pad over blind via size : Drilling Dia.+ 6 mils
What kind of Laser : CO2
Filling via capability : Inner layer only
Skip via : Yes
Buried via hole size : 4 mils
Blind via hole size : 4 mils
Target pad over blind via size : Drilling Dia.+ 6 mils
What kind of Laser : CO2
Filling via capability : Inner layer only
Skip via : Yes
HDI : High Density Interconnection
The IPC defines HDI printed circuit board as organic substrates with vias of 6 mils(150 um)
or less in diameter, made by any number of processes(laser, photo, plasma, mechanical…..)
The IPC defines HDI printed circuit board as organic substrates with vias of 6 mils(150 um)
or less in diameter, made by any number of processes(laser, photo, plasma, mechanical…..)
Lower Cost
Reduce Layers - Up to 1/3 less layers
Reduce Size - At least 40% smaller
Higher Density at a Lower Cost- Microvias provide blind
and buried vias at a lower cost than drilling or sequential
lamination
Performance Improvement
Board Miniaturization - Thinner, lighter & smaller
Increase Routing Density - Via-in-pads permit closer part
spacing Better Electrical Performance - Lower RFI/EMI
Reduce Layers - Up to 1/3 less layers
Reduce Size - At least 40% smaller
Higher Density at a Lower Cost- Microvias provide blind
and buried vias at a lower cost than drilling or sequential
lamination
Performance Improvement
Board Miniaturization - Thinner, lighter & smaller
Increase Routing Density - Via-in-pads permit closer part
spacing Better Electrical Performance - Lower RFI/EMI
Advantages of HDI
Our HDI capability and process flow:
Copy right 2009, Samsel International Inc. All rights reserved.
6361 Menlo Drive.
San Jose, California, USA 95120
PH: 408-858-5838
support@samsel-international.us
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Current available HDI structures
1+2+1
1+2+1
1+2+1 (Via on Pad)
3+2+3